{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11939491","patent":{"patent_number":"US-11939491","title":"Method of polishing object to be polished containing material having silicon-silicon bond","assignee":null,"inventors":[],"filing_date":"2020-01-30T00:00:00.000Z","publication_date":"2024-03-26T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":12,"abstract":"The present invention provides means capable of achieving both a reduction in the number of defects and a reduction in haze in an object to be polished after polishing at a high level in a method of polishing the object to be polished containing a material having a silicon-silicon bond. The present invention relates to a method of polishing an object to be polished containing a material having a silicon-silicon bond, and the polishing method includes a final polishing step Pf. In this polishing method, the final polishing step Pf has a plurality of polishing sub-steps, the plurality of polishing sub-steps are continuously performed on the same polishing platen, a final polishing sub-step in the plurality of polishing sub-steps is a polishing sub-step Pff of polishing using a polishing composition Sff, a polishing sub-step provided before the polishing sub-step Pff in the plurality of polishing sub-steps is a polishing sub-step Pfp of polishing using a polishing composition Sfp, and the polishing composition Sff satisfies at least one of the following condition (A) or the following condition (B): condition (A): a value of a haze parameter of the polishing composition Sff obtained in a standard test 1 is smaller than a value of the haze parameter of the polishing composition Sfp obtained in the standard test 1, and condition (B): the polishing composition Sff contains an abrasive Aff, a basic compound Bff, and hydroxyethyl cellulose."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of polishing object to be polished containing material having silicon-silicon bond","description":"The present invention provides means capable of achieving both a reduction in the number of defects and a reduction in haze in an object to be polished after polishing at a high level in a method of p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11939491","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11939491","citation_suggestion":"Patentable. \"Method of polishing object to be polished containing material having silicon-silicon bond\" (US-11939491). https://patentable.app/patents/US-11939491","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11939491","json":"https://patentable.app/api/llm-context/US-11939491","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T11:50:13.550Z"}