{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11942424","patent":{"patent_number":"US-11942424","title":"Via patterning for integrated circuits","assignee":null,"inventors":[],"filing_date":"2021-12-01T00:00:00.000Z","publication_date":"2024-03-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An interconnect structure and a method of forming the interconnect structure are provided. The interconnect structure includes one or more metal lines in direct contact with a top surface of one or more devices and one or more vias in direct contact with top surfaces of the one or more metal lines. The interconnect structure also includes one or more dielectric pillars in direct contact with the top surface of the one or more devices. A height of a top surface of the one or more dielectric pillars above the one or more devices is equal to a height of a top surface of the one or more vias above the one or more devices."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Via patterning for integrated circuits","description":"An interconnect structure and a method of forming the interconnect structure are provided. The interconnect structure includes one or more metal lines in direct contact with a top surface of one or mo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11942424","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11942424","citation_suggestion":"Patentable. \"Via patterning for integrated circuits\" (US-11942424). https://patentable.app/patents/US-11942424","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11942424","json":"https://patentable.app/api/llm-context/US-11942424","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T17:25:43.242Z"}