{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11942439","patent":{"patent_number":"US-11942439","title":"Semiconductor package structure","assignee":null,"inventors":[],"filing_date":"2022-05-13T00:00:00.000Z","publication_date":"2024-03-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package structure","description":"A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring stru","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11942439","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11942439","citation_suggestion":"Patentable. \"Semiconductor package structure\" (US-11942439). https://patentable.app/patents/US-11942439","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11942439","json":"https://patentable.app/api/llm-context/US-11942439","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:57:49.238Z"}