{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948849","patent":{"patent_number":"US-11948849","title":"Package-embedded board","assignee":null,"inventors":[],"filing_date":"2021-03-11T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package-embedded board includes: a core layer having a through-hole portion; a package at least partially disposed in the through-hole portion and including a die pad, an electronic component disposed on the die pad, and a molded portion covering the electronic component; and a core insulating material disposed in the through-hole portion and covering the core layer and the package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package-embedded board","description":"A package-embedded board includes: a core layer having a through-hole portion; a package at least partially disposed in the through-hole portion and including a die pad, an electronic component dispos","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948849","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948849","citation_suggestion":"Patentable. \"Package-embedded board\" (US-11948849). https://patentable.app/patents/US-11948849","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948849","json":"https://patentable.app/api/llm-context/US-11948849","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:43:36.240Z"}