{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948850","patent":{"patent_number":"US-11948850","title":"Semiconductor module and method for manufacturing semiconductor module","assignee":null,"inventors":[],"filing_date":"2021-09-02T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":37,"abstract":"In one aspect of the semiconductor module, the sealing material on the lower side of the die stage is thinner than the sealing material on the upper side of the semiconductor element, a bent portion that forms a step with respect to vertical direction in the first lead is provided in a region sealed by the sealing material in the first lead, the side where the die stage is present of the step is positioned below the side where the die stage is not present of the step due to the step, the side where the die stage is not present of the step in the first lead protrudes from one end side of the sealing material, and a groove is provided on an upper side surface, a lower side surface, or both of them of the bent portion of the first lead."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor module and method for manufacturing semiconductor module","description":"In one aspect of the semiconductor module, the sealing material on the lower side of the die stage is thinner than the sealing material on the upper side of the semiconductor element, a bent portion t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948850","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948850","citation_suggestion":"Patentable. \"Semiconductor module and method for manufacturing semiconductor module\" (US-11948850). https://patentable.app/patents/US-11948850","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948850","json":"https://patentable.app/api/llm-context/US-11948850","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:00:26.013Z"}