{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948852","patent":{"patent_number":"US-11948852","title":"Semiconductor device package","assignee":null,"inventors":[],"filing_date":"2021-04-23T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"The present disclosure provides a semiconductor device package including a first substrate, a second substrate disposed over the first substrate, an electronic component disposed between the first substrate and the second substrate, a spacer disposed between the first substrate and the electronic component, and a supporting element disposed on the first substrate and configured to support the second substrate. The spacer is configured to control a distance between the first substrate and the second substrate through the electronic component. A method of manufacturing a semiconductor device package is also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package","description":"The present disclosure provides a semiconductor device package including a first substrate, a second substrate disposed over the first substrate, an electronic component disposed between the first sub","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948852","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948852","citation_suggestion":"Patentable. \"Semiconductor device package\" (US-11948852). https://patentable.app/patents/US-11948852","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948852","json":"https://patentable.app/api/llm-context/US-11948852","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:23:04.858Z"}