{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948855","patent":{"patent_number":"US-11948855","title":"Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader","assignee":null,"inventors":[],"filing_date":"2022-05-03T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"An integrated circuit (IC) package comprises a substrate having an outer portion close to the perimeter of the substrate, an inner portion surrounded by the outer portion, and an upper surface incorporating a wiring layer for the bonding of a semiconducting die (e.g., via its bottom face). The IC package includes a metallic or otherwise thermally conductive heat spreader thermally bonded on an inner surface of a boss on its bottom side to the top surface of the semiconducting die, and extending on its top surface to the edges of the substrate to maximize heat dissipation from the die. The boss extends toward the semiconducting die and is thermally coupled to the top face of the semiconducting die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader","description":"An integrated circuit (IC) package comprises a substrate having an outer portion close to the perimeter of the substrate, an inner portion surrounded by the outer portion, and an upper surface incorpo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948855","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948855","citation_suggestion":"Patentable. \"Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader\" (US-11948855). https://patentable.app/patents/US-11948855","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948855","json":"https://patentable.app/api/llm-context/US-11948855","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:26:45.111Z"}