{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948866","patent":{"patent_number":"US-11948866","title":"Semiconductor device","assignee":null,"inventors":[],"filing_date":"2021-10-29T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor device includes: first and second semiconductor elements, each of which has first and second electrodes; a first lead mounting the first semiconductor element; a second lead mounting the second semiconductor element; a sealing resin covering the first and second semiconductor elements; a third lead disposed apart from the first and second leads in a y direction, exposed from the sealing resin, and electrically connected to the first electrode of the first semiconductor element; a fifth lead disposed apart from the first and second leads on the opposite side to the third lead, exposed from the sealing resin, and electrically connected to the second electrode of the first semiconductor element; and a sixth lead disposed apart from the first and second leads on the same side as the fifth lead, exposed from the sealing resin, and electrically connected to the second electrode of the second semiconductor element."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device","description":"A semiconductor device includes: first and second semiconductor elements, each of which has first and second electrodes; a first lead mounting the first semiconductor element; a second lead mounting t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948866","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948866","citation_suggestion":"Patentable. \"Semiconductor device\" (US-11948866). https://patentable.app/patents/US-11948866","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948866","json":"https://patentable.app/api/llm-context/US-11948866","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:15:32.921Z"}