{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948873","patent":{"patent_number":"US-11948873","title":"Semiconductor package including a support solder ball","assignee":null,"inventors":[],"filing_date":"2021-12-20T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package including: a first substrate; a first semiconductor device on the first substrate; a first mold layer covering the first semiconductor device; a second substrate on the first mold layer; a support solder ball interposed between the first substrate and the second substrate, and electrically disconnected from the first substrate or the second substrate, wherein the support solder ball includes a core and is disposed near a first sidewall of the first semiconductor device; and a substrate connection solder ball disposed between the first sidewall of the first semiconductor device and the support solder ball to electrically connect the first substrate to the second substrate, wherein a top surface of the first semiconductor device has a first height from a top surface of the first substrate, and the core has a second height which is equal to or greater than the first height."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including a support solder ball","description":"A semiconductor package including: a first substrate; a first semiconductor device on the first substrate; a first mold layer covering the first semiconductor device; a second substrate on the first m","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948873","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948873","citation_suggestion":"Patentable. \"Semiconductor package including a support solder ball\" (US-11948873). https://patentable.app/patents/US-11948873","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948873","json":"https://patentable.app/api/llm-context/US-11948873","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:35:02.484Z"}