{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948877","patent":{"patent_number":"US-11948877","title":"Hybrid package apparatus and method of fabricating","assignee":null,"inventors":[],"filing_date":"2021-03-24T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":24,"abstract":"Some features pertain to a hybrid package that includes a die, a first substrate structure, and a first metallization structure that is at least partially coplanar with the substrate. The die is electrically coupled to the first metallization structure and the first substrate through a second metallization structure. The first metallization structure is configured to provide an electrical path for data signaling. The second metallization structure is configured as a ground plane and is coupled to a ground signal. The first substrate structure is configured to provide an electrical path for power signaling."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Hybrid package apparatus and method of fabricating","description":"Some features pertain to a hybrid package that includes a die, a first substrate structure, and a first metallization structure that is at least partially coplanar with the substrate. The die is elect","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948877","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948877","citation_suggestion":"Patentable. \"Hybrid package apparatus and method of fabricating\" (US-11948877). https://patentable.app/patents/US-11948877","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948877","json":"https://patentable.app/api/llm-context/US-11948877","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:45:26.470Z"}