{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948891","patent":{"patent_number":"US-11948891","title":"Semiconductor package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2021-04-01T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A semiconductor package is provided. The semiconductor package can include a first redistributed layer on which a plurality of semiconductor chips and a plurality of passive devices are mounted on one surface, a second redistributed layer electrically connected to the first redistributed layer through a via, an external connection terminal formed on the lower surface of the second redistributed layer, a first mold provided to cover the plurality of semiconductor chips and the plurality of passive devices on the first redistributed layer, and a second mold provided between the first redistributed layer and the second redistributed layer. Each of the first redistributed layer and the second redistributed layer includes a wiring pattern and an insulating layer and is composed of a plurality of layers, and at least one of the plurality of semiconductor chips is disposed between the first redistributed layer and the second redistributed layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method thereof","description":"A semiconductor package is provided. The semiconductor package can include a first redistributed layer on which a plurality of semiconductor chips and a plurality of passive devices are mounted on one","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948891","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948891","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method thereof\" (US-11948891). https://patentable.app/patents/US-11948891","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948891","json":"https://patentable.app/api/llm-context/US-11948891","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:25:32.142Z"}