{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11948914","patent":{"patent_number":"US-11948914","title":"Chip package structure with integrated device integrated beneath the semiconductor chip","assignee":null,"inventors":[],"filing_date":"2022-07-20T00:00:00.000Z","publication_date":"2024-04-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure and a method of forming the same are provided. The package structure includes a package substrate, a semiconductor chip disposed over the package substrate, and an integrated device located below and bonded to the lower surface of the semiconductor chip. The semiconductor chip has a lower surface facing the package substrate and is electrically connected to the package substrate through conductive structures. The integrated device is laterally surrounded by the conductive structures, and the integrated device and the conductive structures are located within boundaries of the semiconductor chip when viewed in a direction perpendicular to the lower surface of the semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package structure with integrated device integrated beneath the semiconductor chip","description":"A package structure and a method of forming the same are provided. The package structure includes a package substrate, a semiconductor chip disposed over the package substrate, and an integrated devic","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11948914","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11948914","citation_suggestion":"Patentable. \"Chip package structure with integrated device integrated beneath the semiconductor chip\" (US-11948914). https://patentable.app/patents/US-11948914","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11948914","json":"https://patentable.app/api/llm-context/US-11948914","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:47:56.709Z"}