{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11953461","patent":{"patent_number":"US-11953461","title":"Electrode structure","assignee":null,"inventors":[],"filing_date":"2019-04-08T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["G01N","G06K","G01N","G01N","G06K","G06K","H01L","H01L","H01L"],"num_claims":12,"abstract":"An electrode formed by molding a semiconductor device with resin. The electrode comprises: a first resin mold portion formed on a front surface of the semiconductor device and having a first thickness (t1); a second resin mold portion formed on a back surface of the semiconductor device and having a second thickness (t2) greater than the first thickness; and an exposed portion formed in a part of the first resin mold portion corresponding to an end of the semiconductor device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electrode structure","description":"An electrode formed by molding a semiconductor device with resin. The electrode comprises: a first resin mold portion formed on a front surface of the semiconductor device and having a first thickness","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11953461","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11953461","citation_suggestion":"Patentable. \"Electrode structure\" (US-11953461). https://patentable.app/patents/US-11953461","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11953461","json":"https://patentable.app/api/llm-context/US-11953461","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:01:38.275Z"}