{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11953462","patent":{"patent_number":"US-11953462","title":"Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects","assignee":null,"inventors":[],"filing_date":"2023-03-16T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["G01N","G01N","G01N"],"num_claims":9,"abstract":"A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects","description":"A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; fill","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11953462","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11953462","citation_suggestion":"Patentable. \"Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects\" (US-11953462). https://patentable.app/patents/US-11953462","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11953462","json":"https://patentable.app/api/llm-context/US-11953462","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:42:32.210Z"}