{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11955396","patent":{"patent_number":"US-11955396","title":"Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly","assignee":null,"inventors":[],"filing_date":"2021-11-26T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor packaging method, a semiconductor assembly and an electronic device comprising the semiconductor assembly are disclosed herein. The semiconductor packaging method comprises providing at least one semiconductor device and a carrier board. A plurality of first alignment solder parts are formed on a passive surface of the semiconductor device, and a plurality of corresponding second alignment solder parts are formed on the carrier board. The method further comprises forming a plurality of alignment solder joints by aligning and soldering the first alignment solder parts to respective ones of the second alignment solder parts whereby the semiconductor device is aligned and fixed to the carrier board; encapsulating the at least one semiconductor device to form a molded package body; sequentially forming a redistribution layer and external terminals on the molded package body so that the connection terminals are connected to the external terminal through the interconnection layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly","description":"A semiconductor packaging method, a semiconductor assembly and an electronic device comprising the semiconductor assembly are disclosed herein. The semiconductor packaging method comprises providing a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11955396","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11955396","citation_suggestion":"Patentable. \"Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly\" (US-11955396). https://patentable.app/patents/US-11955396","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11955396","json":"https://patentable.app/api/llm-context/US-11955396","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:46:20.030Z"}