{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11955409","patent":{"patent_number":"US-11955409","title":"Substrate comprising interconnects in a core layer configured for skew matching","assignee":null,"inventors":[],"filing_date":"2021-01-13T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":24,"abstract":"A package comprising an integrated device and a substrate. The integrated device is coupled to the substrate. The substrate includes a core layer, at least one first dielectric layer coupled to a first surface of the core layer, and at least one second dielectric layer coupled to a second surface of the core layer. The substrate includes a match structure located in the core layer. The match structure includes at least one first match interconnect extending vertically and horizontally in the match structure. The match structure also includes at least one second match interconnect extending vertically in the match structure. The at least one first match interconnect and the at least one second match interconnect are configured for skew matching."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate comprising interconnects in a core layer configured for skew matching","description":"A package comprising an integrated device and a substrate. The integrated device is coupled to the substrate. The substrate includes a core layer, at least one first dielectric layer coupled to a firs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11955409","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11955409","citation_suggestion":"Patentable. \"Substrate comprising interconnects in a core layer configured for skew matching\" (US-11955409). https://patentable.app/patents/US-11955409","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11955409","json":"https://patentable.app/api/llm-context/US-11955409","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:15:25.587Z"}