{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11955435","patent":{"patent_number":"US-11955435","title":"Semiconductor packages","assignee":null,"inventors":[],"filing_date":"2021-12-29T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor package includes a semiconductor die and an encapsulant layer. A mark is formed on a surface of the encapsulant layer. A damage barrier layer is disposed between the mark and the semiconductor die. The damage barrier layer blocks the propagation of laser light used to form the mark from reaching the semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages","description":"A semiconductor package includes a semiconductor die and an encapsulant layer. A mark is formed on a surface of the encapsulant layer. A damage barrier layer is disposed between the mark and the semic","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11955435","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11955435","citation_suggestion":"Patentable. \"Semiconductor packages\" (US-11955435). https://patentable.app/patents/US-11955435","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11955435","json":"https://patentable.app/api/llm-context/US-11955435","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:11:17.427Z"}