{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11955436","patent":{"patent_number":"US-11955436","title":"Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission","assignee":null,"inventors":[],"filing_date":"2019-04-24T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission","description":"Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The pac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11955436","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11955436","citation_suggestion":"Patentable. \"Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission\" (US-11955436). https://patentable.app/patents/US-11955436","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11955436","json":"https://patentable.app/api/llm-context/US-11955436","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T17:59:08.536Z"}