{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11955448","patent":{"patent_number":"US-11955448","title":"Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches","assignee":null,"inventors":[],"filing_date":"2020-05-21T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches","description":"Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodime","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11955448","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11955448","citation_suggestion":"Patentable. \"Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches\" (US-11955448). https://patentable.app/patents/US-11955448","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11955448","json":"https://patentable.app/api/llm-context/US-11955448","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:57:47.561Z"}