{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11955698","patent":{"patent_number":"US-11955698","title":"Grounded BGA wave-guiding interface between an on-package signal launch and an external waveguide","assignee":null,"inventors":[],"filing_date":"2021-11-01T00:00:00.000Z","publication_date":"2024-04-09T00:00:00.000Z","cpc_codes":["G01S","G01S","H01L","H01L","H01L"],"num_claims":20,"abstract":"A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Grounded BGA wave-guiding interface between an on-package signal launch and an external waveguide","description":"A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a sign","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11955698","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11955698","citation_suggestion":"Patentable. \"Grounded BGA wave-guiding interface between an on-package signal launch and an external waveguide\" (US-11955698). https://patentable.app/patents/US-11955698","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11955698","json":"https://patentable.app/api/llm-context/US-11955698","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:19:39.679Z"}