{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11958739","patent":{"patent_number":"US-11958739","title":"Method for ablating or roughening wafer surfaces","assignee":null,"inventors":[],"filing_date":"2021-03-01T00:00:00.000Z","publication_date":"2024-04-16T00:00:00.000Z","cpc_codes":["G01N","H01L","H01L"],"num_claims":23,"abstract":"The present invention provides a simple method for ablating a protective thin film on a bulk surface and roughening the underlying bulk. In an embodiment, silicon nitride thin films, which are useful as etch-stop masks in micro- and nano-fabrication, is removed from a silicon wafer's surface using a hand-held “flameless” Tesla-coil lighter. Vias created by a spatially localized electron beam from the lighter allow a practitioner to perform micro- and nano-fabrication without the conventional steps of needing a photoresist and photolithography. Patterning could be achieved with a hard mask or rastering of the spatially confined discharge, offering—with low barriers to rapid use—particular capabilities that might otherwise be out of reach to researchers without access to conventional, instrumentation-intensive micro- and nano-fabrication workflows."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for ablating or roughening wafer surfaces","description":"The present invention provides a simple method for ablating a protective thin film on a bulk surface and roughening the underlying bulk. In an embodiment, silicon nitride thin films, which are useful ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11958739","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11958739","citation_suggestion":"Patentable. \"Method for ablating or roughening wafer surfaces\" (US-11958739). https://patentable.app/patents/US-11958739","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11958739","json":"https://patentable.app/api/llm-context/US-11958739","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:14:17.710Z"}