{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11959737","patent":{"patent_number":"US-11959737","title":"Method and a system for combined characterisation of structures etched in a substrate","assignee":null,"inventors":[],"filing_date":"2023-05-17T00:00:00.000Z","publication_date":"2024-04-16T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":13,"abstract":"A method and system implementing the method for characterising structures etched in a substrate, such as a wafer, includes at least one structure etched in the substrate, an imaging step including the following steps: capturing, with an imaging device positioned on the top surface of the substrate, at least one image of a top surface of the substrate, and measuring a first data relating to the structure from at least one captured image, at least one interferometric measurement step, carried out with a low-coherence interferometer positioned on the top surface, for measuring with a measurement beam positioned on the structure, at least one depth data relating to a depth of the structure; and a first adjusting step for adjusting the measurement beam according to the first data."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and a system for combined characterisation of structures etched in a substrate","description":"A method and system implementing the method for characterising structures etched in a substrate, such as a wafer, includes at least one structure etched in the substrate, an imaging step including the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11959737","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11959737","citation_suggestion":"Patentable. \"Method and a system for combined characterisation of structures etched in a substrate\" (US-11959737). https://patentable.app/patents/US-11959737","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11959737","json":"https://patentable.app/api/llm-context/US-11959737","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:44:44.971Z"}