{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11961778","patent":{"patent_number":"US-11961778","title":"Semiconductor device package having multi-layer molding compound and method","assignee":null,"inventors":[],"filing_date":"2021-09-27T00:00:00.000Z","publication_date":"2024-04-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device package includes a substrate having a top planar surface and a first semiconductor die electrically connected to the top planar surface of the substrate. The first semiconductor die and substrate define a tunnel and a first molding compound encapsulates the first semiconductor die and fills the tunnel. A second molding compound that is separate and distinct from the first molding compound is mounted on a top surface of the first molding compound. The first molding, when in a flowable state, has a viscosity that is lower than a viscosity of the second molding compound when it is in a flowable state."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package having multi-layer molding compound and method","description":"A semiconductor device package includes a substrate having a top planar surface and a first semiconductor die electrically connected to the top planar surface of the substrate. The first semiconductor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11961778","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11961778","citation_suggestion":"Patentable. \"Semiconductor device package having multi-layer molding compound and method\" (US-11961778). https://patentable.app/patents/US-11961778","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11961778","json":"https://patentable.app/api/llm-context/US-11961778","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:12:51.943Z"}