{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11966203","patent":{"patent_number":"US-11966203","title":"System and method to adjust a kinetics model of surface reactions during plasma processing","assignee":null,"inventors":[],"filing_date":"2020-05-12T00:00:00.000Z","publication_date":"2024-04-23T00:00:00.000Z","cpc_codes":["G05B","G01N","G01N","G05B","H01L","G01N","G01N","G06F"],"num_claims":43,"abstract":"A system is disclosed, in accordance with one or more embodiments of the present disclosure. The system includes a metrology tool configured to acquire one or more measurements of a portion of a sample. The system includes a controller including one or more processors configured to execute program instructions causing the one or more processors to: generate a surface kinetics model output based on a surface kinetics model; determine an expected response of the surface kinetics model output to excitation by polarized light; compare the determined expected response to the one or more measurements; generate one or more metrics based on the comparison between the determined expected response and the one or more measurements of the sample; adjust one or more parameters of the surface kinetics model to generate an adjusted surface kinetics model; and apply the adjusted surface kinetics model to simulate on-sample performance during plasma processing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System and method to adjust a kinetics model of surface reactions during plasma processing","description":"A system is disclosed, in accordance with one or more embodiments of the present disclosure. The system includes a metrology tool configured to acquire one or more measurements of a portion of a sampl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11966203","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11966203","citation_suggestion":"Patentable. \"System and method to adjust a kinetics model of surface reactions during plasma processing\" (US-11966203). https://patentable.app/patents/US-11966203","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11966203","json":"https://patentable.app/api/llm-context/US-11966203","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:14:03.621Z"}