{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11967060","patent":{"patent_number":"US-11967060","title":"Wafer level spatial signature grouping using transfer learning","assignee":null,"inventors":[],"filing_date":"2021-08-17T00:00:00.000Z","publication_date":"2024-04-23T00:00:00.000Z","cpc_codes":["G06T","G06T","G06T","G06T"],"num_claims":18,"abstract":"A wafer map is classified using the machine learning based model and a signature on the wafer map. The machine learning based model uses transfer learning. The machine learning based model can be trained using images from various sources that are extracted and augmented and their features extracted. These extracted features can be classified into defects that occur during semiconductor manufacturing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer level spatial signature grouping using transfer learning","description":"A wafer map is classified using the machine learning based model and a signature on the wafer map. The machine learning based model uses transfer learning. The machine learning based model can be trai","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11967060","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11967060","citation_suggestion":"Patentable. \"Wafer level spatial signature grouping using transfer learning\" (US-11967060). https://patentable.app/patents/US-11967060","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11967060","json":"https://patentable.app/api/llm-context/US-11967060","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:01:59.679Z"}