{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11967542","patent":{"patent_number":"US-11967542","title":"Packaging substrate, and semiconductor device comprising same","assignee":null,"inventors":[],"filing_date":"2020-03-12T00:00:00.000Z","publication_date":"2024-04-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"The embodiment relates to a packaging substrate and a semiconductor device, including an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit; and it applies a glass substrate as a core of the packaging substrate, thereby can significantly improve electrical properties such as a signal transmission rate by connecting the semiconductor element and a motherboard to be closer to each other so that electrical signals are transmitted through as short a path as possible. Therefore, it can significantly improve electrical properties such a signal transmission rate, substantially prevent generating of parasitic element, and simplify a process of treatment for an insulating layer, and thus provides a packaging substrate applicable to a high-speed circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging substrate, and semiconductor device comprising same","description":"The embodiment relates to a packaging substrate and a semiconductor device, including an element unit including a semiconductor element; and a packaging substrate electrically connected to the element","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11967542","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11967542","citation_suggestion":"Patentable. \"Packaging substrate, and semiconductor device comprising same\" (US-11967542). https://patentable.app/patents/US-11967542","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11967542","json":"https://patentable.app/api/llm-context/US-11967542","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:14:15.913Z"}