{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11967578","patent":{"patent_number":"US-11967578","title":"Semiconductor package including post","assignee":null,"inventors":[],"filing_date":"2021-09-20T00:00:00.000Z","publication_date":"2024-04-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a lower redistribution layer disposed on a lower surface of the semiconductor chip including an insulating laver, a redistribution pattern, a via, an under bump metal (UBM), and a post disposed on the redistribution pattern. The post vertically overlaps with the UBM. A mold layer is on the lower redistribution layer and surrounds the semiconductor chip. A connecting terminal is connected to the UBM. The UBM includes a first section contacting the redistribution pattern, and a second section contacting the insulating layer. The lost has a ring shape having an inner surface and an outer surface when viewed a top view. A maximum width of the inner surface is less than a Maximum width of an upper surface of the first section. A maximum width of the outer surface is greater than the maximum width of the upper surface of the first section."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including post","description":"A semiconductor package includes a lower redistribution layer disposed on a lower surface of the semiconductor chip including an insulating laver, a redistribution pattern, a via, an under bump metal ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11967578","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11967578","citation_suggestion":"Patentable. \"Semiconductor package including post\" (US-11967578). https://patentable.app/patents/US-11967578","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11967578","json":"https://patentable.app/api/llm-context/US-11967578","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:14:08.773Z"}