{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11971365","patent":{"patent_number":"US-11971365","title":"Wafer processing system and rework method thereof","assignee":null,"inventors":[],"filing_date":"2022-01-06T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["G01N","H01L","H01L"],"num_claims":12,"abstract":"A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the captured image, calculates a target removal thickness according to distribution of contrast values of the defect pattern, and controls a processing device to perform processing on the wafer according to the target removal thickness."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing system and rework method thereof","description":"A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11971365","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11971365","citation_suggestion":"Patentable. \"Wafer processing system and rework method thereof\" (US-11971365). https://patentable.app/patents/US-11971365","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11971365","json":"https://patentable.app/api/llm-context/US-11971365","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:52:18.352Z"}