{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11972968","patent":{"patent_number":"US-11972968","title":"Fluxless gang die bonding arrangement","assignee":null,"inventors":[],"filing_date":"2020-07-02T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"The present invention features a system and manufacturing arrangement for multiple die chips onto a receiver substrate. The system includes a donor chuck; a receiver chuck configured for supporting the receiver substrate; a pick and place gripper mechanism configured for retrieving a die chip supported on the donor chuck; a gang carrier configured for receiving the die chip from the gripper mechanism; a flipper mechanism configured for delivering the die chip in an inverted orientation relative to the orientation of the die chip when received by the gang carrier; and computer controlled interconnected inspection cameras configured for ensuring accurate alignment of the receiver substrate relative to the die chip in the inverted orientation. The gang carrier has a thermocouple controlled heating element therein to maintain a proper computer controlled temperature therewithin."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fluxless gang die bonding arrangement","description":"The present invention features a system and manufacturing arrangement for multiple die chips onto a receiver substrate. The system includes a donor chuck; a receiver chuck configured for supporting th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11972968","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11972968","citation_suggestion":"Patentable. \"Fluxless gang die bonding arrangement\" (US-11972968). https://patentable.app/patents/US-11972968","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11972968","json":"https://patentable.app/api/llm-context/US-11972968","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:45:31.483Z"}