{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11972977","patent":{"patent_number":"US-11972977","title":"Fabrication of rigid close-pitch interconnects","assignee":null,"inventors":[],"filing_date":"2021-09-08T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A method of forming interconnects is provided. The method includes forming a plurality of mandrels on an interlayer dielectric (ILD) layer. The method further includes forming sidewall spacers on opposite sides of the each mandrel, wherein a portion of the ILD layer is exposed between adjacent sidewall spacers on adjacent mandrels, and removing the exposed portions of the ILD layer to form a first set of trenches between adjacent sidewall spacers. The method further includes forming a first set of interconnects in the first set of trenches, and removing the mandrels to expose portions of the ILD layer between the sidewall spacers. The method further includes removing the exposed portions of the ILD layer to form a second set of trenches between the sidewall spacers, and forming a second set of interconnects in the second set of trenches."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fabrication of rigid close-pitch interconnects","description":"A method of forming interconnects is provided. The method includes forming a plurality of mandrels on an interlayer dielectric (ILD) layer. The method further includes forming sidewall spacers on oppo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11972977","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11972977","citation_suggestion":"Patentable. \"Fabrication of rigid close-pitch interconnects\" (US-11972977). https://patentable.app/patents/US-11972977","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11972977","json":"https://patentable.app/api/llm-context/US-11972977","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:45:09.444Z"}