{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11972987","patent":{"patent_number":"US-11972987","title":"Die level product modeling without die level input data","assignee":null,"inventors":[],"filing_date":"2020-10-16T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","G06N","H01L"],"num_claims":12,"abstract":"A machine learning model for each die for imputing process control parameters at the die. The model is based on wafer sort parametric measurements at multiple test sites across the entire wafer, as well as yield results for the wafer. This allows for a better analysis of outlier spatial patterns leading to improved yield results."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Die level product modeling without die level input data","description":"A machine learning model for each die for imputing process control parameters at the die. The model is based on wafer sort parametric measurements at multiple test sites across the entire wafer, as we","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11972987","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11972987","citation_suggestion":"Patentable. \"Die level product modeling without die level input data\" (US-11972987). https://patentable.app/patents/US-11972987","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11972987","json":"https://patentable.app/api/llm-context/US-11972987","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:43:38.680Z"}