{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11972998","patent":{"patent_number":"US-11972998","title":"Semiconductor package device with dedicated heat-dissipation feature and method of manufacturing semiconductor package device","assignee":null,"inventors":[],"filing_date":"2021-11-29T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A miniaturized and high-power semiconductor package device with its own heat-dissipating ability includes a thermal conductor, a redistribution layer, an electronic device, a molding layer, and a solder ball. The redistribution layer includes a first surface defining an opening, a second surface opposite to the first surface, and a circuit layer. The thermal conductor is disposed in the opening. The electronic device is disposed on the first surface of the redistribution layer above the thermal conductor. The molding layer is formed on the first surface and surrounding the electronic device. The solder balls are disposed on the second surface of the redistribution layer and can form electrical connections to the circuit layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package device with dedicated heat-dissipation feature and method of manufacturing semiconductor package device","description":"A miniaturized and high-power semiconductor package device with its own heat-dissipating ability includes a thermal conductor, a redistribution layer, an electronic device, a molding layer, and a sold","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11972998","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11972998","citation_suggestion":"Patentable. \"Semiconductor package device with dedicated heat-dissipation feature and method of manufacturing semiconductor package device\" (US-11972998). https://patentable.app/patents/US-11972998","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11972998","json":"https://patentable.app/api/llm-context/US-11972998","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:45:13.120Z"}