{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11973000","patent":{"patent_number":"US-11973000","title":"Heat dissipation plate and semiconductor device","assignee":null,"inventors":[],"filing_date":"2021-12-06T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A heat dissipation plate has a structural body including a first metal portion formed from a first metal and a second metal portion formed from a second metal that differs from the first metal and bonded to the first metal portion through solid state bonding. The first metal has a higher thermal conductance than the second metal, and the second metal has a higher mechanical strength than the first metal. The structural body includes a first surface of the heat dissipation plate connected to a semiconductor element and a second surface of the heat dissipation plate located at a side opposite to the first surface. The second surface includes an upper surface of the first metal portion and an upper surface of the second metal portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat dissipation plate and semiconductor device","description":"A heat dissipation plate has a structural body including a first metal portion formed from a first metal and a second metal portion formed from a second metal that differs from the first metal and bon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11973000","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11973000","citation_suggestion":"Patentable. \"Heat dissipation plate and semiconductor device\" (US-11973000). https://patentable.app/patents/US-11973000","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11973000","json":"https://patentable.app/api/llm-context/US-11973000","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:30:25.540Z"}