{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11973012","patent":{"patent_number":"US-11973012","title":"Power module with semiconductor packages mounted on metal frame","assignee":null,"inventors":[],"filing_date":"2021-07-26T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A power module includes a metal frame having a first and second device attach pads, first and second semiconductor packages each having an encapsulant body, a die pad exposed at a lower surface of the encapsulant body, a plurality of leads protruding out from the encapsulant body, and a potting compound that encapsulates both of the first and second semiconductor packages and partially covers the metal frame. The first semiconductor package is mounted on the metal frame such that the die pad of the first semiconductor package faces and electrically contacts the first device attach pad. The second semiconductor package is mounted on the metal frame such that the die pad of the second semiconductor package faces and electrically contacts the second device attach pad. The plurality of leads from each of the first and second semiconductor packages are electrically accessible from outside of the potting compound."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power module with semiconductor packages mounted on metal frame","description":"A power module includes a metal frame having a first and second device attach pads, first and second semiconductor packages each having an encapsulant body, a die pad exposed at a lower surface of the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11973012","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11973012","citation_suggestion":"Patentable. \"Power module with semiconductor packages mounted on metal frame\" (US-11973012). https://patentable.app/patents/US-11973012","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11973012","json":"https://patentable.app/api/llm-context/US-11973012","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:30:46.896Z"}