{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11973045","patent":{"patent_number":"US-11973045","title":"Semiconductor structure and method for forming same","assignee":null,"inventors":[],"filing_date":"2022-02-11T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A semiconductor structure includes: a first substrate, with a first opening being provided on a surface of first substrate; and a first bonding structure positioned in the first opening. The first bonding structure includes a first metal layer and a second metal layer with a melting point lower than that of the first metal layer. The first metal layer includes a first surface in contact with a bottom surface of the first opening and a second surface opposite to the first surface, the second surface is provided with a first groove, an area, not occupied by the first metal layer and the first groove, of the first opening constitutes a second groove, the second metal layer is formed in the first groove and the second groove, and a surface, exposed from the second groove, of the second metal layer constitutes a bonding surface of the first bonding structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor structure and method for forming same","description":"A semiconductor structure includes: a first substrate, with a first opening being provided on a surface of first substrate; and a first bonding structure positioned in the first opening. The first bon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11973045","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11973045","citation_suggestion":"Patentable. \"Semiconductor structure and method for forming same\" (US-11973045). https://patentable.app/patents/US-11973045","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11973045","json":"https://patentable.app/api/llm-context/US-11973045","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:55:53.224Z"}