{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11973053","patent":{"patent_number":"US-11973053","title":"Laser bonding system and laser bonding apparatus","assignee":null,"inventors":[],"filing_date":"2021-04-12T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Laser bonding system and laser bonding apparatus","description":"A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to contr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11973053","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11973053","citation_suggestion":"Patentable. \"Laser bonding system and laser bonding apparatus\" (US-11973053). https://patentable.app/patents/US-11973053","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11973053","json":"https://patentable.app/api/llm-context/US-11973053","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:34:27.850Z"}