{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11973070","patent":{"patent_number":"US-11973070","title":"Double-layer stacked 3D fan-out packaging structure and method making the same","assignee":null,"inventors":[],"filing_date":"2021-12-28T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"The present disclosure provides a double-layer stacked 3D fan-out packaging structure and a method making the structure. The structure includes: a first semiconductor chip, a packaging material layer, a metal connecting pillar, a first rewiring layer, a second rewiring layer, a second semiconductor chip, solder ball bumps, and an underfill layer under the second semiconductor chip. The formed double-layer stacked 3D fan-out packaging structure is capable to package two sets of fan-out wafers in the three-dimension. A single package stacked up after die-cutting has two sets of chips in the third direction. The electrical signals of all chips in a single package can be controlled by arranging a first rewiring layer, a metal connecting post, and the second rewiring layer, so that more chips can be packaged in a single package, thus improving the package integration level and reducing the package volume."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Double-layer stacked 3D fan-out packaging structure and method making the same","description":"The present disclosure provides a double-layer stacked 3D fan-out packaging structure and a method making the structure. The structure includes: a first semiconductor chip, a packaging material layer,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11973070","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11973070","citation_suggestion":"Patentable. \"Double-layer stacked 3D fan-out packaging structure and method making the same\" (US-11973070). https://patentable.app/patents/US-11973070","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11973070","json":"https://patentable.app/api/llm-context/US-11973070","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:45:44.868Z"}