{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11974404","patent":{"patent_number":"US-11974404","title":"Method of producing circuit boards","assignee":null,"inventors":[],"filing_date":"2021-11-16T00:00:00.000Z","publication_date":"2024-04-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of producing circuit boards","description":"There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin sup","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11974404","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11974404","citation_suggestion":"Patentable. \"Method of producing circuit boards\" (US-11974404). https://patentable.app/patents/US-11974404","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11974404","json":"https://patentable.app/api/llm-context/US-11974404","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:57:26.533Z"}