{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11977781","patent":{"patent_number":"US-11977781","title":"Systems and methods for managing thermal dissipation in multi-stacked dies","assignee":null,"inventors":[],"filing_date":"2022-08-08T00:00:00.000Z","publication_date":"2024-05-07T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F","G06F","G06F","G06F","G06F","H01L","H01L"],"num_claims":20,"abstract":"Systems for managing thermal dissipation in multi-stacked memory dies, and methods and computer-readable storage media related thereto, are provided. The system includes memory dies including memory blocks to store data. A processing component is configured to maintain memory block states for the memory blocks. The memory block states include: an open memory block state allowing write operations, and a closed memory block state preventing write operations. The processing component is further configured to: receive a first write command to store first data, and compute first relative distances between open memory blocks in the open memory block state. The processing component is further configured to: select a set of open memory blocks for a first write operation based on the first relative distances so as to manage thermal dissipation, and initiate the first write operation on the first set of open memory blocks."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Systems and methods for managing thermal dissipation in multi-stacked dies","description":"Systems for managing thermal dissipation in multi-stacked memory dies, and methods and computer-readable storage media related thereto, are provided. The system includes memory dies including memory b","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11977781","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11977781","citation_suggestion":"Patentable. \"Systems and methods for managing thermal dissipation in multi-stacked dies\" (US-11977781). https://patentable.app/patents/US-11977781","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11977781","json":"https://patentable.app/api/llm-context/US-11977781","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:12:27.306Z"}