{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11978637","patent":{"patent_number":"US-11978637","title":"Manufacturing method for semiconductor structure and semiconductor structure","assignee":null,"inventors":[],"filing_date":"2021-05-24T00:00:00.000Z","publication_date":"2024-05-07T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":17,"abstract":"The present disclosure provides a manufacturing method for semiconductor structure and a semiconductor structure. The manufacturing method includes: providing a substrate; forming first mask patterns and first mask openings on the substrate, the first mask opening being located between the adjacent first mask patterns; forming second mask patterns and second mask openings on the first mask patterns and the first mask openings, the second mask opening being located between the adjacent second mask patterns; and forming first patterns and first openings on the substrate based on the first mask patterns, the first mask openings, the second mask patterns and the second mask openings."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method for semiconductor structure and semiconductor structure","description":"The present disclosure provides a manufacturing method for semiconductor structure and a semiconductor structure. The manufacturing method includes: providing a substrate; forming first mask patterns ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11978637","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11978637","citation_suggestion":"Patentable. \"Manufacturing method for semiconductor structure and semiconductor structure\" (US-11978637). https://patentable.app/patents/US-11978637","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11978637","json":"https://patentable.app/api/llm-context/US-11978637","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:12:15.197Z"}