{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11978685","patent":{"patent_number":"US-11978685","title":"Glass core patch with in situ fabricated fan-out layer to enable die tiling applications","assignee":null,"inventors":[],"filing_date":"2019-07-25T00:00:00.000Z","publication_date":"2024-05-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a glass substrate, with a plurality of first pads on a first surface of the glass substrate, a plurality of second pads on a second surface of the glass substrate that is opposite from the first surface, a plurality of through glass vias (TGVs), wherein each TGV electrically couples a first pad to a second pad, wherein the plurality of first pads have a first pitch, and wherein the plurality of second pads have a second pitch that is greater than the first pitch, a bridge substrate over the glass substrate, a first die electrically coupled to first pads and the bridge substrate, and a second die electrically coupled to first pads and the bridge substrate, wherein the bridge substrate electrically couples the first die to the second die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Glass core patch with in situ fabricated fan-out layer to enable die tiling applications","description":"Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a glass substrate, with a plurality of first pads on a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11978685","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11978685","citation_suggestion":"Patentable. \"Glass core patch with in situ fabricated fan-out layer to enable die tiling applications\" (US-11978685). https://patentable.app/patents/US-11978685","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11978685","json":"https://patentable.app/api/llm-context/US-11978685","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:50:26.402Z"}