{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11978695","patent":{"patent_number":"US-11978695","title":"Semiconductor package and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2021-10-28T00:00:00.000Z","publication_date":"2024-05-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a first redistribution substrate, a connection substrate on the first redistribution substrate and having a first opening and a second opening that penetrate the connection substrate, a semiconductor chip on the first redistribution substrate and in the first opening of the connection substrate, a chip module on the first redistribution substrate and in the second opening of the connection substrate, and a molding layer that covers the semiconductor chip, the chip module, and the connection substrate. The chip module includes an inner substrate and a first passive device on the inner substrate. In the second opening, the molding layer covers the first passive device on the inner substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and method of fabricating the same","description":"A semiconductor package includes a first redistribution substrate, a connection substrate on the first redistribution substrate and having a first opening and a second opening that penetrate the conne","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11978695","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11978695","citation_suggestion":"Patentable. \"Semiconductor package and method of fabricating the same\" (US-11978695). https://patentable.app/patents/US-11978695","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11978695","json":"https://patentable.app/api/llm-context/US-11978695","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:21:28.955Z"}