{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11978706","patent":{"patent_number":"US-11978706","title":"Electronic package structure, electronic substrate and method of manufacturing electronic package structure","assignee":null,"inventors":[],"filing_date":"2021-08-27T00:00:00.000Z","publication_date":"2024-05-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"An electronic package structure, an electronic substrate, and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate. The substrate includes a bonding region and an alignment structure. The bonding region is located at a side of the substrate and configured to bond with an electronic component. The alignment structure is located at the side of the substrate and out of the bonding region and configured to providing a fiducial mark for position-aligning, wherein the alignment structure comprises a first region and a second region visually distinct from the first region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package structure, electronic substrate and method of manufacturing electronic package structure","description":"An electronic package structure, an electronic substrate, and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate. The substra","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11978706","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11978706","citation_suggestion":"Patentable. \"Electronic package structure, electronic substrate and method of manufacturing electronic package structure\" (US-11978706). https://patentable.app/patents/US-11978706","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11978706","json":"https://patentable.app/api/llm-context/US-11978706","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T11:56:07.580Z"}