{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984326","patent":{"patent_number":"US-11984326","title":"Heat dissipating substrate for semiconductor and preparation method thereof","assignee":null,"inventors":[],"filing_date":"2020-05-29T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"Provided are a heat dissipating substrate and a preparation method thereof, which can form a precise pattern in a thick electrode metal plate and improve insulating strength and peel strength. heat dissipating substrate for semiconductor may include: an electrode metal plate having a plurality of electrode patterns which are electrically insulated from each other by a pattern space formed therebetween; a metal base disposed under the electrode metal plate, and configured to diffuse heat conducted from the electrode metal plate; an insulating layer formed between the electrode metal plate and the metal base; and an insulating material filled portion configured to fill the pattern space and a peripheral portion outside an electrode pattern group composed of the plurality of electrode patterns, and support the electrode patterns while brought in direct contact with side surfaces of the plurality of electrode patterns."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat dissipating substrate for semiconductor and preparation method thereof","description":"Provided are a heat dissipating substrate and a preparation method thereof, which can form a precise pattern in a thick electrode metal plate and improve insulating strength and peel strength. heat di","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984326","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984326","citation_suggestion":"Patentable. \"Heat dissipating substrate for semiconductor and preparation method thereof\" (US-11984326). https://patentable.app/patents/US-11984326","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984326","json":"https://patentable.app/api/llm-context/US-11984326","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:41:59.157Z"}