{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984351","patent":{"patent_number":"US-11984351","title":"Cavity in metal interconnect structure","assignee":null,"inventors":[],"filing_date":"2021-06-14T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit device includes a dielectric structure within a metal interconnect over a substrate. The dielectric structure includes a cavity. A first dielectric layer provides a roof for the cavity. A second dielectric layer provides a floor for the cavity. A material distinct from the first dielectric layer and the second dielectric layer provides a side edge for the cavity. In a central area of the cavity, the cavity has a constant height. The height may be selected to provide a low parasitic capacitance between features above and below the cavity. The roof of the cavity may be flat. A gate dielectric may be formed over the roof. The dielectric structure is particularly useful for reducing parasitic capacitances when employing back-end-of-line (BEOL) transistors."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Cavity in metal interconnect structure","description":"An integrated circuit device includes a dielectric structure within a metal interconnect over a substrate. The dielectric structure includes a cavity. A first dielectric layer provides a roof for the ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984351","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984351","citation_suggestion":"Patentable. \"Cavity in metal interconnect structure\" (US-11984351). https://patentable.app/patents/US-11984351","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984351","json":"https://patentable.app/api/llm-context/US-11984351","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T08:36:29.181Z"}