{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984355","patent":{"patent_number":"US-11984355","title":"Method for manufacturing an interconnection structure having a bottom via spacer","assignee":null,"inventors":[],"filing_date":"2022-06-01T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method includes providing a semiconductor structure including a dielectric layer having an opening exposing a top surface of a metal layer. A bottom via is selectively deposited in the opening and over the metal layer. A barrier layer is deposited over the bottom via and in contact with the dielectric layer at a sidewall of the opening. A top via is formed in the opening, in contact with the barrier layer, and over the bottom via. The top via is separated from the dielectric layer by the barrier layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing an interconnection structure having a bottom via spacer","description":"A method includes providing a semiconductor structure including a dielectric layer having an opening exposing a top surface of a metal layer. A bottom via is selectively deposited in the opening and o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984355","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984355","citation_suggestion":"Patentable. \"Method for manufacturing an interconnection structure having a bottom via spacer\" (US-11984355). https://patentable.app/patents/US-11984355","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984355","json":"https://patentable.app/api/llm-context/US-11984355","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:43:48.006Z"}