{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984371","patent":{"patent_number":"US-11984371","title":"Testing bonding pads for chiplet systems","assignee":null,"inventors":[],"filing_date":"2023-06-27T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Systems, methods, circuits, and apparatus including computer-readable mediums for testing bonding pads in multi-die packages, e.g., chiplet systems. In one aspect, a chiplet system includes multiple integrated circuit devices electrically connected together. The integrated circuit devices include an integrated circuit device including: an integrated circuit, a plurality of first type bonding pads electrically connected to the integrated circuit and electrically connected to at least one other of the integrated circuit devices, and one or more second type bonding pads electrically isolated from the at least one other of the integrated circuit devices. At least one of the plurality of first type bonding pads is configured to be electrically connected to a corresponding one of the one or more second type bonding pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Testing bonding pads for chiplet systems","description":"Systems, methods, circuits, and apparatus including computer-readable mediums for testing bonding pads in multi-die packages, e.g., chiplet systems. In one aspect, a chiplet system includes multiple i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984371","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984371","citation_suggestion":"Patentable. \"Testing bonding pads for chiplet systems\" (US-11984371). https://patentable.app/patents/US-11984371","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984371","json":"https://patentable.app/api/llm-context/US-11984371","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:45:06.631Z"}