{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984407","patent":{"patent_number":"US-11984407","title":"Package structure and communications device with suppressed ion migration in bonding material","assignee":null,"inventors":[],"filing_date":"2021-05-25T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Embodiments of this application disclose a package structure and a communications device to which the package structure is applied. The package structure includes a substrate, a die, and a bonding layer configured to bond the die to the substrate. Charged particles are disposed in the bonding layer. An electrode is disposed on a surface of the die away from the bonding layer. A potential of the electrode is opposite to that of the charged particle. The package structure further includes a first shielding structure. A potential of the substrate is zero. The first shielding structure is located on an outer surface of the die and is located between the bonding layer and the electrode, to prevent the charged particles from migrating to the electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and communications device with suppressed ion migration in bonding material","description":"Embodiments of this application disclose a package structure and a communications device to which the package structure is applied. The package structure includes a substrate, a die, and a bonding lay","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984407","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984407","citation_suggestion":"Patentable. \"Package structure and communications device with suppressed ion migration in bonding material\" (US-11984407). https://patentable.app/patents/US-11984407","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984407","json":"https://patentable.app/api/llm-context/US-11984407","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:30:00.645Z"}