{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984408","patent":{"patent_number":"US-11984408","title":"Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation","assignee":null,"inventors":[],"filing_date":"2021-11-02T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package comprises a lead frame, a die pad, bond pads, and leads. A die may be arranged on the die pad, the die comprising an integrated circuit. In an example, the die and at least a portion of the lead frame are encapsulated with a molding compound (MC). A first thickness of the MC over a first portion of the die is less than a second thickness over a second portion of the die to form a cavity in the MC and the MC directly contacts the first portion and the second portion of the die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation","description":"A semiconductor package comprises a lead frame, a die pad, bond pads, and leads. A die may be arranged on the die pad, the die comprising an integrated circuit. In an example, the die and at least a p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984408","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984408","citation_suggestion":"Patentable. \"Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation\" (US-11984408). https://patentable.app/patents/US-11984408","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984408","json":"https://patentable.app/api/llm-context/US-11984408","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:31:19.640Z"}