{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984414","patent":{"patent_number":"US-11984414","title":"Packaging structure with antenna and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2022-01-26T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A packaging structure with an antenna and a manufacturing method thereof are disclosed. The packaging structure includes a package, an antenna circuit, an interconnecting circuit, an outer-layer circuit, and a chip. The package is internally packaged with a first conducting through hole column and a second conducting through hole column. The antenna circuit is disposed on a first surface and a sidewall of the package. The interconnecting circuit is packaged in the package, and is connected to the antenna circuit by the first conducting through hole column. The outer-layer circuit is disposed on a second surface of the package, and is connected to the interconnecting circuit by the second conducting through hole column. The outer-layer circuit is further connected to a conductive pin. The chip is packaged in the package, and is connected to the interconnecting circuit or the outer-layer circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging structure with antenna and manufacturing method thereof","description":"A packaging structure with an antenna and a manufacturing method thereof are disclosed. The packaging structure includes a package, an antenna circuit, an interconnecting circuit, an outer-layer circu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984414","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984414","citation_suggestion":"Patentable. \"Packaging structure with antenna and manufacturing method thereof\" (US-11984414). https://patentable.app/patents/US-11984414","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984414","json":"https://patentable.app/api/llm-context/US-11984414","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:42:32.402Z"}